We offer solution sets for a wide range of semiconductor process applications such as CMP, etching, metrology, wafer handling systems, wafer inspection, wafer slicing, tab bonding, wire bonding, ion implantation, lithography and flat-panel applications

Our clients look for us to provide high throughput and fast-past solutions. The trend in our industry is speed and response. The ideation of these new technological concepts moves so fast that clients need response measured in days and weeks, not months and quarters.